Faculty

Chen, Kuan-Neng(陳冠能)

OFFICE: Room 506, Engineering Building 4
TEL: 886-3-5712121 ext. 31558
FAX: 886-3-5724361
E-mail: knchen@nycu.edu.tw

Laboratory Webpage
https://3dic.lab.nycu.edu.tw

Background

• Vice President for International Affairs at Chiao Tung Campus, National Yang Ming Chiao Tung University, 2021-Now
• Chair Professor, Department of Electronics Engineering, National Yang Ming Chiao Tung University, 2021-Now
• Program Director, Micro-Electronics Program, Ministry of Science and Technology. 2021-Now
• Vice Dean, International College of Semiconductor Technology, National Yang Ming Chiao Tung University, 2015-Now
• Specially Appointed Professor, Tokyo Institute of Technology (Tokyo Tech), 2017-Now
• Joint-Appointment R&D Director, Industrial Technology Research Institute (ITRI), 2016-Now

 

• National Academy of Inventors (NAI) Fellow, “have demonstrated a highly prolific spirit of innovation in creating or facilitating outstanding inventions that have made a tangible impact on the quality of life, economic development, and the welfare of society”, 2020
• IET Fellow, 2020
• IMAPS Fellow, 2021
• IEEE Fellow, "for contributions to 3D integrated circuit and packaging technologies"

 

• Vice President for International Affairs / School Employment Vice President for International Affairs, National Yang Ming Chiao Tung University / National Chiao Tung University, 2019-2022
• Distinguished Professor, Department of Electronics Engineering, National Chiao Tung University, 2018-2021
• Professor, Department of Electronics Engineering, National Chiao Tung University, 2012-2018
• Associate Professor, Department of Electronics Engineering, National Chiao Tung University, 2009-2012
• Research Staff Member, IBM T.J. Watson Research Center, 2005-2009
• INTEL Component Research, 2002

 

• Ph.D, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
• M.S., Department of Materials Science and Engineering, Massachusetts Institute of Technology

 

• Consultant, Industrial Technology and Research Institute (ITRI), 2009 - 2016
• Adjunct Research Staff Member, National Chip Implementation Center, 2011 - 2016
• Guest Editor, MRS Bulletin, 2015
• Secretary General, The Electronics Devices and Materials Association (EDMA), 2011-2014
• Deputy Director, ASE-NCTU R&D Center, 2011 - 2013

 

• Visiting Professor, Indian Institute of Technology Bombay (IIT Bombay)
• Visiting Professor, University of Colorado, Boulder, 2017, 2018
• Visiting Scientist, Massachusetts Institute of Technology, 2015
• Visiting Professor, The University of British Columbia, Vancouver, BC, Canada, 2011
• Academic Visitor, IBM T. J. Watson Research Center, 2010
• Visiting Researcher, Nanyang Technological University, Singapore, 2009

 

• Research Excellence Award, Pan Wen Yuan Foundation, 2022
• National Industrial Innovation Award, Ministry of Economic Affairs,R.O.C., 2021
• IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, 2021
• MOST Outstanding Research Award (Twice), Ministry of Science and Technology, 2021, 2018
• Futuristic Breakthrough Technology Award, Future Tech (MOST), 2019
• Micron Chair Professor, 2018-2021
• IEEE EPS Exceptional Technical Achievement Award, "For contributions to 2.5D and 3D IC heterogeneous integration, with focus on interconnect technologies", 2018
• Outstanding Engineering Professor Award, The Chinese Institute of Engineers (CIE), 2017
• Outstanding Electrical Engineering Professor Award, The Chinese Institute of Electrical Engineering (CIEE), 2014
• EDMA Outstanding Service Award, 2014
• Outstanding Youth Electrical Engineer Award, The Chinese Institute of Electrical Engineering (CICC), 2012
• EDMA Outstanding Youth Award, 2010
• Adventech Young Professor Award, 2010-2012
• IBM Invention Achievement Award, Dec 2006, May 2007, Sep 2007, Dec 2007, Aug 2008

 

• NCTU Outstanding Industry-Academia Cooperation Achievement Award, 2021, 2020, 2017, 2014, 2012, 2011
• NCTU Excellent Teaching Award, 2020
• First NCTU EECS Outstanding Young Scholar Award, 2016
• NCTU Excellent Academic Advisor Award, 2016, 2015, 2013
• NCTU College of EE Excellent Teaching Award, 2021, 2015

Research

• Three-Dimensional Integrated Circuits (3D IC)
• Heterogeneous Integration
• Advanced Packaging Technology

Introduction

     Dr. Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He is currently Associate Dean of International College of Semiconductor Technology, and Chair Professor of Institute of Electronics in National Yang Ming Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.

    Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST Outstanding Research Award (2 times), MOST Futuristic Breakthrough Technology Award, NYCU/NCTU Distinguished Faculty Awards, NYCU/NCTU Outstanding Industry-Academia Cooperation Achievement Awards (6 times), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored more than 300 publications, including 3 books and 6 book chapters, and holds 83 patents. He was Guest Editor of IEEE Transactions on Components, Packaging, and Manufacturing Technology, and MRS Bulletin. He served as General Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a Fellow of National Academy of Inventors (NAI), IEEE, IET, and IMAPS, and a member of Phi Tau Phi Scholastic Honor Society.

     In addition to his faculty position, Dr. Chen is currently Program Director of Micro-Electronics Program in Ministry of Science and Technology in Taiwan, Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.

Lab. Website or Detailed C.V.

Course

• 3D IC
• Semicondutor Physics and Devices
• Semicondutor Experiments